Microelectronics Engineer Entry to Experienced Level (Maryland)

Responsibilities

With the ever-increasing technological complexities in the world of Microelectronics, we need talented Microelectronics Engineers to be part of our team designing, assembling, testing, and qualifying the next generation of electronics hardware in support of our mission. Our goal is to provide microelectronics services of the highest quality to ensure the success of the Agency's mission. Microelectronics Engineers utilize electrical, computer, mechanical, and materials engineering knowledge and skills to design, assemble, test, analyze and qualify the next generation of electronics hardware in support of the NSA mission. The National Security Agency (NSA) currently has opportunities for three types of Microelectronics positions: Microelectronics Package Design Engineer, Microelectronics Process Engineer, and Microelectronics Technology Engineer. 1. A Microelectronics Package Design Engineer is focused on developing advanced microelectronics systems through the design of custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include: - Knowledge of Application Specific Integrated Circuit (ASIC) and Field Programmable Gate Array (FPGA) design - Knowledge of Register Transfer Level (RTL) design including Verilog and VHDL - Knowledge of Digital/Analog Logic design/simulation, functional verification, Design For Test (DFT), testability analysis - Understanding and development of assembly specifications in accordance with industry standards - Understanding and application of Signal Integrity (SI)/Power Integrity (PI)/Electro-Magnetic Integrity (EMI) Analysis methodologies for design - Conduct research including studies, experiments, and investigations on new or alternate methodologies - Enhance process design and development to support advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics 2. A Microelectronics Process Engineer is focused on assembly and fabrication of advanced microelectronics systems such as custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies and/or system enclosures. Areas of responsibility can also include: - Participate in assembly and fabrication process improvement efforts - Conduct research including studies, experiments, and investigations on new or alternate methodologies, fabrication, and/or assembly equipment - Enhance process and mature development of advanced assembly techniques such as Three Dimensional Interconnect (3DI) and Printed Electronics 3. A Microelectronics Technology Engineer is focused on the test, failure, and physical analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCM), printed circuit board (PCB), high density redistribution layers, 3D multi-layer integrated technologies, and/or system enclosures. Areas of responsibility can also include: - Conduct environmental and reliability tests - High-pin-count Integrated Circuit (IC) design and operation validation - Parametric testing - Accelerated testing / qualification / screening - Develop test plans according to industry and military specifications - Design and develop test platforms - Support quality assurance efforts for developed and fielded systems - Disassembly and sample preparation for physical analysis of ICs for failure analysis - Perform scanning electron microscopy (SEM), low energy electrons microscopy (LEEM), and/or atomic force microscopy (AFM)

Job Summary

As an Engineering and Physical Science professional, you will use your skills to create the systems and tools that will be used to enhance the operation of intelligence. You will advise, administer and perform scientific projects, such as planning, designing, and constructing specialized equipment, and ensuring adherence to sound engineering and scientific standards and principles. The NSA offers multiple areas of focus for facilities engineers, including computer, architectural, electrical, mechanical, and structural. In addition, we are seeking skills that include computer design, microelectronics, radio frequency design, and systems engineering. Apply your science and engineering skills to protect the nation.

Qualifications

The qualifications listed are the minimum acceptable to be considered for the position. For all 3 types of Microelectronics Engineers, the degree must be in Engineering, Physics, or Materials Science from an accredited college or university, or a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology) For all of the above degrees, if program is not ABET EAC accredited, it must include specified coursework.* *Specified coursework includes courses in differential and integral calculus and 5 of the following 18 areas: (a) statics or dynamics, (b) strength of materials/stress-strain relationships, (c) fluid mechanics, hydraulics, (d) thermodynamics, (e) electromagnetic fields, (f) nature and properties of materials/relating particle and aggregate structure to properties, (g) solid state electronics, (h) microprocessor applications, (i) computer systems, (j) signal processing, (k) digital design, (l) systems and control theory, (m) circuits or generalized circuits, (n) communication systems, (o) power systems, (p) computer networks, (q) software development, (r) Any other comparable area of fundamental engineering science or physics, such as optics, heat transfer, or soil mechanics. ------------------------------------------------------------------------------- FOR MICROELECTRONICS PACKAGE DESIGN ENGINEER: Relevant experience must be in one or more of the following: developing advanced microelectronics systems through the design of integrated circuits, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures using electronic design automation (EDA) tools. ENTRY/DEVELOPMENTAL With an Engineering degree, entry is with a Bachelor's degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 1 year of relevant experience. FULL PERFORMANCE With a degree in Engineering, entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's or Doctoral degree plus 1 year of relevant experience. SENIOR Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered. ------------------------------------------------------------------- FOR MICROELECTRONICS PROCESS ENGINEER: Relevant experience must be in one or more of the following: assembly or fabrication process improvement of advanced microelectronics systems such as integrated circuit enclosures, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures. ENTRY/DEVELOPMENTAL With a professional Engineering degree, entry is with a Bachelor's degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 1 year of relevant experience. FULL PERFORMANCE With a degree in professional Engineering, entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's or Doctoral degree plus 1 year of relevant experience. SENIOR Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered. ------------------------------------------------------------------------ FOR MICROELECTRONICS TECHNOLOGY ENGINEER: ENTRY/DEVELOPMENTAL With a professional Engineering degree, entry is with a Bachelor's degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 1 year of relevant experience. Relevant experience must be in one or more of the following: assembly or fabrication process improvement of advanced microelectronics systems such as integrated circuit enclosures, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures. FULL PERFORMANCE With a degree in professional Engineering, entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's degree plus 1 year of relevant experience, or a Doctoral degree and no experience. With a degree in either (1) Physics or Materials Science from an accredited college or university or (2) a relevant professional technical field (for example, microelectronics, semiconductor, chemistry, architecture, computer science, mathematics, hydrology, geology), entry is with a Bachelor's degree plus 3 years of relevant experience, or a Master's or Doctoral degree plus 1 year of relevant experience. Relevant experience must be in one or more of the following: characterization, test, reliability, or failure root cause analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures. SENIOR Entry is with a Bachelor's degree plus 7 years of relevant experience, or a Master's degree plus 5 years of relevant experience, or a Doctoral degree plus 3 years of relevant experience. An Associate's degree plus 8 years of relevant experience may also be considered. Relevant experience must be in one or more of the following: characterization, test, reliability, or failure root cause analysis of advanced microelectronics systems such as integrated circuits, custom multichip modules (MCMs), printed circuit boards (PCBs), high density redistribution layers, 3D multi-layer integrated technologies, or system enclosures.

Competencies

Microelectronics Package Design Engineer Specialized Skills: - Concepts, theories, and methods for designing, analyzing, testing, and integrating electrical and communications systems - Designing analog and digital circuits (e.g., FPGAs, ASICs, PCBs) - Use modeling/simulation to evaluate designs - Experience using Electronic Design Automation (EDA) tools for ASIC and/or PCB design is required - Applying engineering principles to perform printed circuit board layout - Applying engineering principles to perform redistribution layer design and layout - Applying engineering principles to perform 3D integration design and layout - Application of the scientific principles, methods, and processes used to conduct research studies (e.g., study design, data collection and analysis, and reporting results) Microelectronics Process Engineer Specialized Skills: - Concepts, theories, and methods for designing, analyzing, testing, and integrating electrical and communications systems is desired - Understanding of circuit design is desired (e.g., FPGAs, ASICs, PCBs) - Understanding of modeling/simulation to evaluate designs is desired - Experience using Electronic Design Automation (EDA) tools is desired - Applying engineering principles to perform printed circuit board layout is desired - Application of the scientific principles, methods, and processes used to conduct research studies (e.g., study design, data collection and analysis, and reporting results) - Semiconductor or integrated circuit quality assurance and materials science/fabrication experience is preferred Microelectronics Technology Engineer Specialized Skills: - Concepts, theories, and methods for designing, analyzing, testing, and integrating electrical and communications systems - Understanding of digital circuits designs and schematics (e.g., FPGAs, ASICs) - Understanding of packaging and/or assembling processes for custom microelectronics (ASICs, FPGAs, PCBs) test and evaluation - Use modeling/simulation to evaluate microelectronics designs for test - Testing of integrated circuit devices, FPGAs and complex microelectronics systems - Microelectronics design engineering including analog or digital logic design is desired. - Experience using Electronic Design Automation (EDA) tools is desired - Application of the scientific principles, methods, and processes used to conduct research studies (e.g., study design, data collection and analysis, and reporting results) - Semiconductor or integrated circuit quality assurance and materials science/fabrication experience is desired - Develop test plans for environmental and reliability evaluations - Understanding of industry and military test and reliability standards is desired Technical competencies for all three positions may include: - Create and maintain documentation on technical information - Operate specialized scientific and technical equipment - Attend conferences and communicate with people in a particular technical field to keep abreast of new technologies and information - Serve as a subject matter expert to support research and development efforts - Collaborate extensively with customers and develop requirements, project milestones, deliverables and reports - Research emerging technologies for application(s) within the Agency - Concepts, theories, and methods related to the composition, structure, and properties of materials, and the identification/processing of optimal materials for various uses - Solving technical problems - Translate conceptual designs into technical specifications - Evaluate information in technical documents to understand its importance and significance - Work with customers to clarify their needs and to determine how their needs can be met - Semiconductor or integrated circuit quality assurance - Operate specialized scientific and technical equipment - Conduct research including studies, experiments, and investigations on new or alternate methodologies - Conduct research including studies, experiments, and investigations on new or alternate fabrication and assembly/disassembly equipment and analysis tools - Participate in disassembly and/or physical analysis of microelectronics systems or integrated circuits and contribute to process improvement efforts - Develop and apply new processes and techniques for the full die imaging and analysis of ICs - Develop and apply new processes and techniques for full die processing and sample preparation of ICs through the use of polishing/lapping, wet chemistry, plasma etching, thin film coating, and optical metrology tools - Use microscopy techniques such as scanning electron microscopy (SEM), low energy electron microscopy (LEEM), and/or atomic force microscopy (AFM) - Develop new techniques and advanced processes for circuit edit, cross sectioning, and imaging for IC's using state of the art focused ion beam tools - Develop IC failure analysis techniques The ideal candidate is someone with excellent problem-solving, communication, and interpersonal skills who is: - Motivated - Creative - Able to work effectively across several different functional areas in a collaborative environment - Well-organized and able to handle multiple assignments - Customer service and requirements focused - Detail oriented