Wafer Process Development Summer Intern

The intern will have an exciting opportunity to develop chemical mechanical polish wafer process for recording head fabrication in a wafer process development team at our R&D site in Bloomington, MN.

-   You will participate in CMP (chemical mechanical polish) process development in a development environment, under the supervision of one or more engineers. Projects may include developing CMP processes, collecting/analyzing data and presenting the results to the engineering community. 

-   You will acquire hands-on key skills to CMP process development that are applicable to both hard drive and semiconductor industries. 

-   Working in a team environment, you will be exposed to senior engineers and will have the opportunity to share your knowledge and learn from them.

-   Good written and verbal communication abilities. 

-   Highly productive in both team and independent work environments. 

-   Must be detail-oriented

-   BS or MS student pursuing a degree in Materials Science, Chemical Engineering, Chemistry, Electrical Engineering, Physics or related science and engineering disciplines. 

-   GPA 3.0 or better

-   Cleanroom experience a plus but not must

Our Normandale campus spans two suburbs, Edina and Bloomington, and serves as the Recording Head development and manufacturing arm of Seagate. Located in the heart of a bustling community, Seagate offers an on-site café, or if you prefer, you can drive to one of many restaurants just minutes away. Need to grab a gift over lunch time? Shopping is abundant in the area. If working out is your thing, the on-site fully equipped fitness center hosts wellness programs, outdoor activities, tournaments and group workouts. Looking for something more laid back? Reset in one of our meditation rooms, or simply take a walk around our indoor walking path. On-site cultural festivals, celebrations and community volunteer opportunities also abound.

 

Location: Normandale, United States

Travel: None